Contents
- Introduction & Scope
- Wikipedia Background
- Anchor & SEO Policy We Follow
- Exact IC Picks
- Timing Contracts & ISR/DMA Budgets
- Low-Power, DC/DC & LDO Strategy
- Interfaces: Level Shift, USB–UART, PHY & Field Buses
- Memory, RTC & Precision Sensing
- EMC, SI/PI & PCB Co-Design
- Verification: Sim → HIL → Corner Soak
- Per-Model Four-Block Notes
- Executive FAQ
- Glossary
If you’re evaluating an integrated circuit for a product you must ship and support, this guide emphasizes deterministic timing, dependable power, clean interfaces。Neutral background (nofollow):Integrated circuit · Operational amplifier · ADC · CAN bus · SPI · I²C
Anchor & Policy We Follow
- Respect the rigorous technical rules of integrated circuits and quote them for reference only.
Exact IC Picks
| Model | Category | Brand | Positioning |
|---|---|---|---|
| ADS1115IDGSR | 16-bit I²C ADC | Texas Instruments | Workhorse sigma-delta ADC for precision sensing; tiny VSSOP10 footprint. |
| MCP1700T-3302E/TT | ULP LDO 3.3 V | Microchip | Very low IQ for always-on rails; popular SOT-23-3 variant. |
| TPS54331DR | 3 A Buck (SWIFT) | Texas Instruments | 28 V in → 3 A out, Eco-mode; fixed 570 kHz for compact designs. |
| MAX485CSA | RS-485 Transceiver | Maxim Integrated (ADI) | 2.5 Mbps, classic 5 V half-duplex RS-485 device. |
| TXS0108EPWR | 8-bit Level Translator | Texas Instruments | Auto-direction 1.2–5 V; push-pull & open-drain support. |
| DP83848CVV | 10/100 Ethernet PHY | Texas Instruments | Single-port PHY with robust RMII/MII and strong docs. |
| CP2102N-A01-GQFN28 | USB-to-UART Bridge | Silicon Labs | Crystal-less FS USB bridge, 3 Mbaud, easy drivers. |
| 24LC256-I/SN | 256-Kb I²C EEPROM | Microchip | Simple NVM for configs & logs; common SOIC-8 pinout. |
| DS1307+ | I²C RTC | Maxim Integrated (ADI) | Baseline RTC with battery backup; ubiquitous ecosystem. |
| OPA333AIDBVT | Zero-Drift Op-Amp | Texas Instruments | Chopper-stabilized, 1.8 V, micro-power for precision front-ends. |
| MCP3008-I/P | 10-bit SPI ADC | Microchip | Eight-channel SAR ADC; hobby to industrial bridge device. |
| MCP2515T-I/SO | Stand-Alone CAN Controller | Microchip | CAN 2.0B via SPI for MCUs without native CAN. |
Timing Contracts & ISR/DMA Budgets
Integrated circuits do not guarantee determinism—your usage does. Treat timing as a versioned artifact you can read in a budget meeting. Specify clock sources, DMA ring sizes, ISR worst-case execution time, and allowed jitter for each path (ADC→DSP, UART→parser, PHY→stack).
# Example timing artifact (illustrative)
adc_path:
source: 16-bit sigma-delta (I2C @ 400 kHz)
dma: n/a (I2C ISR + double buffer)
deadlines:
acquisition_us: 1250
filter_wcet_us: 180
p99_end_to_end_us: 1600
uart_ingress:
bridge: USB-UART, 3 Mbaud
ring_desc: 256
isr_budget_us: 10
ethernet_rx:
phy: 10/100 RMII
desc: 128
isr_budget_us: 12
Low-Power, DC/DC & LDO Strategy
Model perf/W across sleep, standby, burst, and steady-state. Favor a buck for the heavy rail, then a low-IQ LDO for noise-sensitive domains. Publish wake ladders (who powers first), and enforce brownout policies (what falls back safely). Archive bench plots per release.
Interfaces: Level Shift, USB–UART, PHY & Field Buses
- Level translators: Choose auto-direction for mixed push-pull/open-drain busses; bound edge rates for long cables.
- USB-UART bridges: Crystal-less bridges simplify BOM; still validate ESD/EMI and enumeration latency.
- Ethernet PHYs: Lock RMII/MII timing; test cable magnetics and ESD; measure link-up latency under brownouts.
- RS-485: Test reflections, termination and bias at corners; record error counters under EMI bursts.
- CAN (via controller): Filter tables and bus-off recovery are part of your timing contract, not an afterthought.
Memory, RTC & Precision Sensing
External EEPROM and RTCs look simple—until resets, brownouts, and leap days intersect. Log reset causes, gray-code critical counters, and rehearse battery-swap or time-sync paths in HIL. For precision op-amps and ADCs, publish gain/offset trims and temperature drift in the release notes, not just the lab book.
EMC, SI/PI & PCB Co-Design
- Protect long lines (RS-485, Ethernet) with CM chokes and TVS at the connector boundary.
- Stage decoupling (bulk→mid→HF) at the device; validate PDN with pulsed loads.
- Respect analog returns for op-amp/ADC nodes; route quiet references like RF.
- For RMII and MII, lock trace length matching and publish it in the constraints repo.
Verification: Sim → Formal → Hardware-in-the-Loop
Every driver gets a self-checking simbench; the stack gets HIL with environmental corners (cold/room/hot, supply dips, EMI injections). CI fails merges that regress timing slack, raise watchdog counts, or break low-power targets. OTA procedures get a fail-safe window and roll-back logs.
Per-Model Four-Block Notes (Plain Text Names)
Texas Instruments — ADS1115IDGSR
1) Functions
Low-power 16-bit sigma-delta ADC with PGA and comparator. Ideal for precision sensors where throughput is modest and resolution headroom matters.
2) Package & Electrical
VSSOP-10; I²C up to 860 SPS; clean analog references; short, quiet traces and split planes near sensors.
3) Performance & Calibration
Calibrate gain/offset per unit; publish ENOB vs temperature; log p95/p99 latency in your timing artifact.
4) Applications
Industrial sensing, metrology, battery monitors, precision thermistors/bridges.
Microchip — MCP1700T-3302E/TT
1) Functions
Ultra-low-quiescent 3.3 V LDO for always-on rails and battery devices.
2) Package & Electrical
SOT-23-3; verify dropout and thermal at worst-case load; pay attention to ESR of output caps.
3) Performance & Calibration
Measure IQ across temp; brownout thresholds published; sleep current histograms archived.
4) Applications
Keep-alive logic, RTC rails, wireless sensor nodes.
Texas Instruments — TPS54331DR
1) Functions
3 A step-down converter for main rails and moderate loads; fixed 570 kHz switching.
2) Package & Electrical
SOIC-8; copper area for heat; ground-referenced current loops; layout per datasheet figure.
3) Performance & Calibration
Validate efficiency tables; transient response vs load steps; EMI scans with spread-spectrum strategy.
4) Applications
Core 3.3/5 V rails, gateways, HMI panels, edge compute nodes.
Maxim Integrated (ADI) — MAX485CSA
1) Functions
Classic half-duplex RS-485 transceiver; up to 2.5 Mbps for noisy, long links.
2) Package & Electrical
SOIC/SO; bus bias resistors and termination; surge/ESD protection at connectors.
3) Performance & Calibration
Bit-error counters; reflection tests; stub lengths documented; hot-plug behavior measured.
4) Applications
Industrial networks, building automation, remote I/O.
Texas Instruments — TXS0108EPWR
1) Functions
Auto-direction level shifter for mixed-voltage SoCs and sensors.
2) Package & Electrical
TSSOP-20; series resistors for ringing; pull-ups sized for open-drain lines; edge-rate awareness.
3) Performance & Calibration
Throughput vs drive; debounce; timing vs cable length; latch-up tests at extremes.
4) Applications
MCU/FIFO/FPGA glue, display/touch busses, multi-domain boards.
Texas Instruments — DP83848CVV
1) Functions
Robust 10/100 Ethernet PHY, RMII/MII, proven in industrial designs.
2) Package & Electrical
LQFP; magnetics selection; ESD/TVS at RJ-45; length-matched traces and 50 Ω impedance control.
3) Performance & Calibration
Link-up time under brownouts; error counters; cable length tolerance; thermal at enclosure steady-state.
4) Applications
Industrial gateways, PLCs, embedded HMIs.
Silicon Labs — CP2102N-A01-GQFN28
1) Functions
Crystal-less USB-to-UART for configuration ports and bootloaders.
2) Package & Electrical
QFN-28; USB impedance; ESD/EMI near connector; keep noisy returns off analog ground.
3) Performance & Calibration
Enumeration times; CDC driver robustness; suspend/resume wake; brownout recovery.
4) Applications
Factory debug, field service ports, user firmware updates.
Microchip — 24LC256-I/SN
1) Functions
256-Kb I²C EEPROM for configuration, keys, and logs.
2) Package & Electrical
SOIC-8; write-cycle timing; bus pull-ups; ESD for field-writable nodes.
3) Performance & Calibration
Endurance policy; wear leveling; supply dips during writes; CRC over records.
4) Applications
Parameter storage, calibration data, audit logs.
Maxim Integrated (ADI) — DS1307+
1) Functions
Baseline I²C RTC with backup supply and simple BCD calendar.
2) Package & Electrical
SOIC/DIP; battery-backed domain; leakage and swap behavior measured.
3) Performance & Calibration
Drift vs temperature; sync policy to host time; leap-year handling regression tests.
4) Applications
Data logging, scheduled telemetry, human-visible timestamps.
Texas Instruments — OPA333AIDBVT
1) Functions
Zero-drift op-amp for micro-volt level sensing with low power draw.
2) Package & Electrical
SOT-23-5; guard rings; Kelvin connections; low-noise references and filters.
3) Performance & Calibration
Auto-zero artifacts; 1/f characterization; gain/offset trims in production.
4) Applications
Load cells, thermocouples (with cold-junction), precision current shunts.
Microchip — MCP3008-I/P
1) Functions
Eight-channel 10-bit SAR ADC via SPI; simple and reliable.
2) Package & Electrical
PDIP/SOIC/TSSOP; sample/hold considerations; source impedance limits.
3) Performance & Calibration
Linearity, DNL/INL checks; throughput vs SPI clock; input filter corner.
4) Applications
Sensor banks, control panels, battery monitoring.
Microchip — MCP2515T-I/SO
1) Functions
Stand-alone CAN controller for MCUs lacking native CAN.
2) Package & Electrical
SOIC-18; SPI nets; CAN transceiver placement with chokes/TVS; split termination support.
3) Performance & Calibration
Acceptance filters; bus-off recovery; error counters under disturbance tests.
4) Applications
Industrial/vehicular control, long-cable networks, robust telemetry.
Executive FAQ
Q: When is a higher-ASP IC the cheaper choice overall?
A: When it deletes external parts (magnetics, crystals, op-amps), shrinks layer count, or cuts months of firmware/EMC work—TCO beats unit price.
Q: How do we keep timing stable as features grow?
A: Version your timing contract, enforce DMA-first I/O, and block merges on ISR/DMA regressions.
Q: What reduces EMC surprises?
A: Freeze connector pinouts with choke/TVS, publish PDN step-load plots, and archive CISPR-25/32 spectra per release.
Glossary
- OPN: Orderable part number (exact device code used as anchor text).
- PDN: Power-distribution network.
- ENOB: Effective number of bits; practical ADC resolution.
- RMII/MII: Ethernet MAC-PHY interfaces with timing constraints.
For dependable integrated circuit sourcing—accurate datasheets, stable timing budgets, EMC-ready layouts, and lifecycle alternates—partner with YY-IC Integrated Circuits to carry your designs from EVT to multi-year production.